uchas.blogg.se - Cavity pcb

238000002360 preparation method Methods 0.000 abstract description 4.

229920001451 Polypropylene glycol Polymers 0.000 abstract description 25.

229920002120 photoresistant polymers Polymers 0.000 claims 1.

238000010438 heat treatment Methods 0.000 claims description 2.

230000000875 corresponding Effects 0.000 claims description 4.

239000011889 copper foil Substances 0.000 claims description 7.

239000000758 substrate Substances 0.000 claims abstract description 13.

238000004519 manufacturing process Methods 0.000 title claims abstract description 19.

Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Application filed by 주식회사 디에이피 filed Critical 주식회사 디에이피 Priority to KR1020120025604A priority Critical patent/KR101336635B1/en Publication of KR20130104247A publication Critical patent/KR20130104247A/en Application granted granted Critical Publication of KR101336635B1 publication Critical patent/KR101336635B1/en Links ( en Inventor 최봉윤 Original Assignee 주식회사 디에이피 Priority date (The priority date is an assumption and is not a legal conclusion. Google Patents KR20130104247A - Method for manufacturing cavity pcb KR20130104247A - Method for manufacturing cavity pcb